GaN HEMT Epitaxy | Power Wafertech Group

GaN Wafers

GaN HEMT Epitaxy

Precision-grown AlGaN/GaN HEMT structures for high-frequency RF and high-power switching. Featuring low-defect buffers and high-density 2DEG channels for superior device performance.
  • Size — 2"–8"
  • Substrate platform — Sapphire, Si or SiC
  • Epitaxial Structure — AlGaN/GaN HEMT (Custom Al composition & GaN thickness)
  • 2DEG Characteristics — High density (>1.0 × 10¹³ cm⁻²)
  • Packaging — Single wafer cassette, vacuum sealed
Detailed Specifications

Specifications by wafer type.

Select a wafer type to view detailed specs

Parameter RF HEMT Power HEMT
Passivation SiN —
Cap Layer GaN GaN
Barrier AlGaN AlGaN / (In)AlN
Interlayer AlN AlN
Channel GaN GaN
Buffer GaN GaN
Nucleation Nucleation layer Nucleation layer
Substrate Sapphire Sapphire
Size 2”, 4”, 6” 2”, 4”, 6”

Export Control Notice

Export of this product is regulated by the Ministry of Commerce of the PRC (MOFCOM). An export license must be obtained prior to shipment.

Applications

Where this wafer delivers value

01

RF power amplifiers

GaN-on-SiC / GaN-on-Si HEMT epiwafers for 5G/6G massive MIMO, satellite communication (SATCOM), and phased-array radar systems.

02

Fast-Charging & Consumer

GaN on Si HEMT epi wafers for ultra-fast chargers (USB-PD), wireless charging, and compact power supplies in smartphones, laptops, and IoT devices.

03

Power Conversion & Data Centers

GaN HEMT epi on sapphire/silicon for AI server PSUs, industrial motor drives, and renewable energy inverters (solar/wind). Enabling higher power density and efficiency.

04

Electric vehicles

Si-based GaN HEMT epitaxial wafers for 800V onboard chargers (OBC), DC-DC converters, and traction inverters, enabling smaller, lighter, and more efficient EV power systems.

FAQ

Common questions about this product

Quick answers on material selection, customization, testing and ordering.

GaN-on-SiC: Best for high-power RF (5G/6G, radar) due to excellent thermal conductivity. GaN-on-Si: Cost-effective for power electronics (fast charging, EV OBC) and scalable to 8-inch. GaN-on-Sapphire: Economical platform for RF and optoelectronics where thermal demands are lower.

Yes. We offer full customization of Al composition and thickness to tune 2DEG density, mobility, and threshold voltage. AlN/(In)AlN barrier structures and custom buffer layers are also available.

GaN HEMT epitaxy wafers are available from 2" to 8" (custom sizes available). Standard specs include Epi-ready surfaces, low defect density, and strict TTV/Bow/Warp control.

Yes. We are R&D friendly with low MOQ. We support rapid prototyping (fast turnaround), pilot runs, and seamless transition to high-volume production.

Technical Inquiry

Speak to Engineers About Your Wafer Needs

Share your material, dimensions, specifications, application or project stage. Our team will review your requirements and respond within one business day.

Engineering-led response

Inquiries are routed to the appropriate technical or commercial team.

Address

No. 1389, Lianmei Road, Lianhua Industrial Zone, Tong’an, Xiamen, Fujian 361100, China

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Emailvictorchan@powerwafertech.com Phone+86-592-5633652