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Crystal Growth
Precise doping control and low defect density (PVT, LEC, VGF)
About Power Wafertech Group
From Crystal Growth to Epitaxial Wafers
Discover PWG's full-cycle manufacturing capabilities for compound semiconductor substrates and epi wafers. Delivering engineering collaboration from R&D to high-volume production.
Company Overview
Your End-to-End Material Partner
Power Wafertech Group is a full-cycle material manufacturer of compound semiconductor substrates and epitaxial wafers, including SiC, GaN, InP, GaAs, GaSb, and InSb. We control the core processes—from crystal growth and substrate fabrication to epitaxial deposition—ensuring supply chain security and strict material consistency.
We support global customers with strict specification adherence, complete batch traceability, and rapid engineer-to-engineer support. From R&D prototyping to repeat production, we deliver documented, high-quality materials for your device programs.
Technology & Manufacturing
An Integrated Wafer Development and Processing Flow
A fully controlled, in-house manufacturing flow. We ensure strict quality control, full batch traceability, and secure supply at every stage of your device program.
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Wafer Processing
Advanced slicing, grinding, and CMP polishing for Epi-ready surfaces
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Epitaxy
HVPE / MOCVD / MBE growth with tight thickness and doping uniformity
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Fabrication
Downstream processing including wafer dicing, thinning, and metallization
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Characterization
Comprehensive inspection using XRD, AFM, and PL mapping. Complete CoA provided.
WAFER SERVICES
Precision Wafer Processing & Device Process Support
A complete portfolio of precision processing and thin-film deposition services. We deliver tailored solutions from substrate processing to complex device fabrication, ensuring performance meets your exact project needs.
Wafer Processing
High-accuracy CMP polishing, dicing, and wafer thinning for 4H-SiC, GaSb, InSb, and other wide bandgap/III-V materials.
Dicing
Wafer Thinning
Thin Film Deposition
Optical and electrical coatings via e-beam evaporation or sputtering. High-adhesion metals (Au, Ti/Pt/Au) and IR/UV anti-reflection films.
AR Coatings
Metal Deposition
Wafer Bonding
Advanced bonding solutions including 4H-SiC-on-Insulator (4H-SiCOI) for high-performance RF, power devices, and integrated photonics.
4H-SiCOI
Ion Implantation
Precise control over species, energy, and dose to form conductive or isolation regions in SiC, GaN, Si and other compound semiconductors.
Precision Doping
Quality & Inspection
Quality Evidence Across the Order Lifecycle
Quality expectations are aligned at specification review and supported through incoming, in-process and outgoing controls. Available reports, traceability fields and packaging options are confirmed per product and order.
- Incoming, in-process and outgoing inspection
- COA or inspection report availability by product
- Batch-level records and traceability
- Clean packaging requirements confirmed per order
- Responsive after-sales and issue coordination
Quality Test Reports
Verified Standards & Management Systems
4H-SiC Wafer Test Report
AlN on Sapphire Template
Blue LED Wafer on Sapphire Test Report
InP Wafer Test Report
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Collaboration Evidence
Proven Collaboration Models: From Spec to Production
Representative examples of how we support industry and research programs. Detailed project data and client identities are protected under strict NDAs.
Industry Program
Client Challenge
Scaling validated substrate specs to high-volume production.
PWG Solution
Precision CMP polishing, wafer thinning, and high-volume dicing for 4H-SiC. Delivering Fab-ready substrates with strict batch consistency.
Research Program
Client Challenge
Low-volume custom epitaxy for novel device characterization.
PWG Solution
Rapid prototyping and custom epitaxy with low MOQ. MOCVD/MBE growth of multi-layer stacks coupled with full material characterization.
Application Development
Client Challenge
Customized doping and surface treatment for emerging architectures.
PWG Solution
Precision ion implantation and tailored metal coatings for device isolation and ohmic contacts.
Facilities & Global Support
Four Production Bases, Laboratories and Global Support
View each site's business scope. Facility information is documented subject to formal validation.
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Production Base
Base 01
Substrate Materials
In-house crystal growth and material synthesis
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Production Base
Base 02
Wafer Processing
Slicing, grinding and polishing
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Production Base
Base 03
Epitaxy & Thin Films
Advanced epitaxy growth and thin-film deposition
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Production Base
Base 04
Custom Engineering
Special formats, QA and program support
Manufacturing Facilities
ISO-certified cleanrooms equipped for crystal growth, wafer fabrication, and epitaxial deposition.
Inspection Laboratory
Equipped with XRD, AFM, and PL mapping for rigorous material characterization and inspection.
Credentials & Global Service
Securing global supply chains with strict batch traceability, NDA-protected engineering support, and secure cleanroom packaging.
Work with Power Wafertech
Partner with Power Wafertech
Explore our wafer portfolio or discuss a material, processing or program requirement with our team.