MATERIAL SCIENCE · PRECISION MANUFACTURING
Compound Semiconductor Substrates & Epi Wafers
From R&D to high-volume production. PWG delivers SiC, GaN, AlN, InP, GaAs, GaSb, InSb and specialty wafers with strict quality control and fast lead times.
Substrate Wafers
Epitaxial Wafers
Specialty Wafers · Engineering Support
ABOUT POWER WAFERTECH GROUP
Precision Engineered Wafers
Power Wafertech Group (PWG) is a full-cycle material manufacturer of compound semiconductor substrates and epitaxial wafers, including SiC, GaN, InP, GaAs, GaSb, and InSb. We control the core processes—from crystal growth and substrate fabrication to epitaxial deposition—ensuring supply chain security and strict material consistency.
We support global customers with strict specification adherence, complete batch traceability, and rapid engineer-to-engineer support. From R&D prototyping to repeat production, we deliver documented, high-quality materials for your device programs.
We support global customers with strict specification adherence, complete batch traceability, and rapid engineer-to-engineer support. From R&D prototyping to repeat production, we deliver documented, high-quality materials for your device programs.
Explore our engineering approach
ENGINEERING-LED DELIVERY
From initial material evaluation to repeat production.
25+
Years of Industry Experience
Industry experience
500+
Customers Served
Customer programs served
4
Production Sites
Manufacturing network
QA
Quality Documentation
Scope confirmed per inquiry
PRODUCT PORTFOLIO
Substrates & Epitaxial Wafers
Three focused product families: standard and custom substrates, epitaxial wafers, and specialty configurations for demanding device programs.
Substrate Wafers
Low-defect substrates for demanding device fabrication.
MATERIALS
SiC · GaN · AlN · GaAs · InP · GaSb · InSb · Silicon
APPLICATIONS
Power devices · RF · Photonics · Sensors
Epitaxial Wafers
Precision epitaxial growth with tight thickness and doping control.
STRUCTURES
SiC-based · GaN-based · GaAs-based · InP-based · GaSb-based
PROGRAM SUPPORT
MOCVD / MBE · Rapid Prototyping · Volume Production
Custom & Specialty Wafers
Custom-engineered wafers for non-standard specifications and specialized device programs.
PROCESSING CAPABILITIES
Polishing · Wafer Dicing · Thinning · Coating
CUSTOM SPECIFICATIONS
Non-standard Sizes · Custom Structures
FIND BY APPLICATION
Applications & Industries
Engineered materials tailored to your voltage, thermal, and fabrication requirements.
SELECTED APPLICATION
Power Electronics
Optimized for high-voltage, high-efficiency power devices. Supporting demanding applications like EV powertrains, renewable energy inverters, and AI data center power supplies.
RECOMMENDED SOLUTIONS
SiC · GaN
Explore Power Solutions
WHY POWER WAFERTECH
More Than a Wafer Supplier
From custom specification to repeat production. We provide the engineering collaboration and supply chain security your program needs.
01
Engineering-Led Customization
Custom-engineered materials tailored to your device specifications. We define precise parameters—dimensions, orientation, and surface finish—to match your exact application needs.
02
Development-to-Production Support
Seamless scale-up from R&D to mass production. Bridging the gap with rapid prototyping, flexible low-volume runs, and secure repeat manufacturing.
03
Controlled Quality and Traceability
100% in-process inspection with full batch traceability. Rigorous process control and documented testing data ensure consistent quality and secure, long-term supply.
ENGINEERING & MANUFACTURING
Precision Processes.
Controlled at Every Stage.
Controlled at Every Stage.
Fully vertically integrated manufacturing. From crystal growth to epitaxial growth, we maintain strict process control at every step to ensure optimal material quality and device performance.
Explore All
01. Crystal Growth
Precise control of doping and stoichiometry using advanced bulk growth methods (e.g., PVT, LEC, VGF) to minimize defects from the very start.
02. Substrate Preparation
Advanced slicing, grinding, and CMP polishing to achieve sub-nanometer surface roughness, strict TTV/Bow/Warp control, and Epi-ready surfaces.
03. Epitaxial Growth
MOCVD and MBE capabilities delivering tight thickness and doping uniformity, and low defect densities to your device structure.
04. Quality Inspection
Comprehensive inspection using XRD, AFM, and PL mapping. Full batch traceability with cleanroom packaging ensures secure, high-yield handoff.
PROGRAM CONTINUITY
Specification control, full documentation, and batch-level traceability from R&D to production.
QUALITY & PROGRAM SUPPORT
Built-in Quality. End-to-End Engineering Support.
Quality is embedded at every stage—from incoming material selection and SPC process control to final testing. We provide complete documentation, strict specification adherence, and responsive engineer-to-engineer support to ensure a seamless transition from prototype to volume production.
ISO 9001 Certified Quality Processes
Batch Traceability & CoC
Complete Test Reports & CoA
Rapid Engineer-to-Engineer Support
Talk to an Engineer
TRUSTED COLLABORATION
Supporting Industry, Research and Emerging Technologies
Accelerating material innovation from R&D to mass production. Partnering with industry leaders and research institutions on custom wafers, specialized fabrication, and secure volume supply.
INDUSTRY PROGRAMS
Scalable from prototype to volume production
Empowering semiconductor manufacturers with custom specifications, rapid prototyping, and secure, high-volume supply chains.
RESEARCH COLLABORATION
Customized materials for specialized research
Partnering with leading research institutes on novel material evaluation, custom epitaxy, and non-standard wafer fabrication to accelerate scientific breakthroughs.
EMERGING TECHNOLOGY PROJECTS
Flexible support for early-stage programs
Providing flexible low-volume pilot runs, fast prototyping, and expert technical guidance for confidential programs under strict NDA protection.
Collaboration Network
Trusted by global industry leaders and top-tier research institutions.
NEWS & INSIGHTS
Latest from Power Wafertech
View all news
Industry Trends
2026-09-01 14:19:48
8-inch SiC substrates are moving from pilot to mainstream. Explore 2026 supply, pricing and epitaxy implications for power device makers.
Industry Trends
2026-09-01 14:20:09
AI racks are moving from 10 kW to over 100 kW. See how 800 V HVDC architecture splits demand between SiC and GaN, and what it means for epiwafer specs.
Technical Insights
2026-10-12 17:38:03
β-Ga₂O₃ Substrates for DUV Detection & Radiation Devices
TECHNICAL INQUIRY
Speak to Engineers About Your Wafer Needs
Submit your material, specifications, and project stage. Our engineering team will respond within 1 business day.
Direct Engineer-to-Engineer Support
Your inquiry is routed directly to our technical team for a rapid, knowledgeable response.
Address
No. 1389, Lianmei Road, Lianhua Industrial Zone, Tong’an, Xiamen, Fujian 361100, China
Phone
