SiC Epitaxy | High Uniformity&Low Defect | Power Wafertech

SiC Wafers

SiC Epitaxy

SiC epitaxial wafers grown by CVD, delivering excellent thickness uniformity and low defect density. Designed for 600V to 10kV power devices (SBDs, MOSFETs, IGBTs), enabling high-performance applications in EVs, industrial drives, and renewable energy.
  • Polytypes — 4H-SiC (homoepitaxy) · 3C-SiC (homo- & heteroepitaxy)
  • Conductivity — N-type, P-type, Semi-insulating
  • Diameters — 2″, 4″, 6″, 8″
  • Thickness range — 0.5 – 200µm (customizable)
  • Structure — Custom multilayers, buffer layers, precise doping profiles
Detailed Specifications

Specifications by wafer type.

Select a wafer type to view detailed specs

Parameter 4H-SiC Epitaxy
Substrate
Diameter 2", 4", 6", 8"
Orientation On-axis, off-axis
Conductivity N-type P-type Semi-insulating
Resistivity 0.015 – 0.028 Ω·cm ≤0.3Ω·cm > 1E8 Ω·cm
Surface Roughness ≤ 0.2nm
MPD ≤ 1cm⁻²
Epi Layer
Conductivity N-type P-type Semi-insulating
Thickness Range 0.5 ~ 200µm (Customizable)
Thickness Uniformity ≤ 10% ≤10% ≤10%
Carrier Concentration 1E14 ~ 1E19 cm⁻³ 1E14 ~ 1E19 cm⁻³ 1E14 ~ 1E19 cm⁻³
Carrier Uniformity ≤ 20% ≤ 20% ≤20%
Applications

Where this wafer delivers value

01

EV & Fast Charging

High-voltage and low-resistance epi layers for electric vehicle powertrains and fast-charging systems. Optimized for 650V-1700V SiC MOSFETs and JBS diodes, featuring high thickness uniformity of ≤4% and precise doping profiles.

02

Industrial & Renewable Energy

Reliable epi wafers designed for harsh-environment energy conversion and heavy machinery. Engineered for high-power SiC MOSFETs, SBDs, and 1200V+ power modules in solar inverters, energy storage, and rail transit systems.

03

AI Data Center Power

Enabling ultra-low switching loss epi layers for high-density server power supplies (PSUs). Tailored for Trench MOSFETs and high-efficiency rectifiers, delivering low BPDs and minimal surface roughness for maximum power efficiency.

04

Ultra-High Voltage (Grid & ESS)

Thick epitaxial layers for next-generation smart grids and energy storage systems (ESS). Supporting 10kV+ IGBTs, GTOs, and PN junctions with our ultra-thick epi capability ranging from 30 to 200µm.

FAQ

Common questions about this product

Quick answers on material selection, customization, testing and ordering.

For standard 4H-SiC homoepitaxy, carrier concentration can be controlled over approximately 1×10¹⁴ to 1×10¹⁹ cm⁻³. This depends on the conductivity type (N-type or P-type) and your specific epi design.

For standard 4H-SiC homoepitaxy, thickness uniformity can be controlled to approximately ≤10%. For selected P-type SiC epi structures, uniformity can reach ≤4%. Actual performance depends on wafer size, epi thickness, and structure.

Yes. PWG can develop custom multilayer epitaxial structures, including buffer layers, current-spreading layers, channel layers, barrier layers, and other device-specific structures.

Yes. We offer 30–200 µm thick SiC epitaxial layers for ultra-high-voltage applications (up to 10kV+). Thickness, doping concentration, and uniformity are optimized according to your target breakdown voltage.

We implement strict epi process control to minimize Basal Plane Dislocations (BPDs) and Stacking Faults (SFs). Typical defect density is maintained at industry-leading levels to ensure high device yield and reliability. Full mapping data is available upon request.

Technical Inquiry

Speak to Engineers About Your Wafer Needs

Share your material, dimensions, specifications, application or project stage. Our team will review your requirements and respond within one business day.

Engineering-led response

Inquiries are routed to the appropriate technical or commercial team.

Address

No. 1389, Lianmei Road, Lianhua Industrial Zone, Tong’an, Xiamen, Fujian 361100, China

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Emailvictorchan@powerwafertech.com Phone+86-592-5633652